Details

<p>.- Flip Chip Technology.- Cu-Cu Hybrid Bonding.- Fan-In Technology.- Fan-Out Technology.- Chiplet Communications (Bridges).- Co-Packaged Optics.</p>

<p>John H. Lau, Ph.D., P.E., from July 2019 to June 2021,&nbsp;was the CTO of Unimicron, Taoyuan, Taiwan, where he has been a Senior Special Project Assistant since July 2021.&nbsp;Prior to that, he was a&nbsp;Senior Scientist/MTS with the Hewlett-Packard Laboratory and Agilent, Palo Alto, CA, USA, for 20 years; the Director of the System Packaging Laboratory, Institute of Microelectronics, Singapore, for two years; a Visiting Professor with The Hong Kong University of Science and Technology, Hong Kong, for one year; a Specialist with the Industrial Technology Research Institute, Hsinchu, Taiwan, for five year; a&nbsp;senior technical advisor at ASM Pacific Technology in Hong Kong for five years. He earned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana–Champaign. With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than&nbsp;530&nbsp;peer-reviewed technical publications&nbsp;(385 are the principalinvestigator),&nbsp;invented more than&nbsp;52&nbsp;issued or pending US patents&nbsp;(31 are the principal inventor),&nbsp;and given more than&nbsp;350&nbsp;lectures/workshops/keynotes worldwide. He has authored or coauthored&nbsp;23&nbsp;textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging,&nbsp;chiplet design and heterogeneous integrated packaging,&nbsp;reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.<br></p>

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.<p></p><p>The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.</p>

Presents both in theory and practice Comprehensive studies in design, materials, process, fabrication, and reliability of various technology Provides in-depth treatment of a number of major topics in packaging